Chip-Package Co-Design Methodology for Global (PDF)

This paper proposes a global methodology combining electromagnetic (EM) analysis with chip power switching macro-modeling for accurate co-design of re-distribution layers (RDLs). Differences between segregated approach (where Chip, RDL and package are analysed separately and then combined following cascade techniques) and integrated/global approach (where Chip, RDL and package are analysed as one whole entity) are quatified, yielding suggested guidelines. The proposed methodologies are applied to real-world NXP-Semiconductors multi-die systems, and correlations with time-domain and frequency-domain measurements are discussed for dedicated test carriers. Keywords— Chip-Package-Board Co-Analysis/Co-Simulation, Re-Distribution Layers Modeling and Co-Design, Power-and Signal Integrity, EMI/EMC Modeling, Frequency-domain/Time-domain characterizations.